DediProg
Automated IC Programming System(Main system)
DP2T Automated IC Programming System
DP2T is the most compact & cost-saving automated programming system. It is able to embed with either one unit of the universal programmer (ProgMaster-S8) to support SPI Flash, EEPROM, MCU, and CPLD…etc. Or All-in-one Programmer (NuProgPlus) to support all devices such as SPI Flash, EEPROM, MCU, CPLD, eMMC & UFS…etc.
DP2T also supports both input & output in Tray or Tape & Reel. With the stable quality & high efficiency, the UPH can easily go up to 1000. Save your budget & lower your labor cost starts from DP2T now.
DP1000-G3 Automated IC Programming System
DP1000-G3 automated chip programming system is the third generation of DP1000, which supports different input/output peripherals to provide an overall solution for IC chip programming. It supports most of the IC families, such as EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc.
The system can embed with 2 sets of ProgMaster-S8 chip Programmer or NuProgPlus to provide up to 32 programming sites with stable quality & high throughput. Additionally, the Auto Teach Feature will automatically adjust the parameter to increase the productivity.
DP2000 Automated IC Programming System
DP2000 is an automated programming system specially designed for tube/tape in & tape out. The system is equipped with a moving programming module and 4 nozzles to handle pick & placement of IC input, positioning, programming and IC output. With 4 nozzles functioning synchronously with the moving programming module, DP2000 easily achieves high throughput, 3,000UPH. This unique and creative design already obtained a patent.
DP3000-G3 Automated IC Programming System
DP3000-G3 automated IC chip device programming system is the third generation of DP3000. It is able to support CSP packages as well as small size packages, like 1.5 x 0.8mm size chips. DP3000-G3 supports different input/output peripherals, like tube, tape, and tray, to provides an overall solution for IC chip device programming with more advanced features.
DP3000-G3 supports all kinds of IC families, such as EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc. It is able to expand up to 96 programming sites, which will keep the high throughput even when handling the high-density memory, like NAND Flash, eMMC, and UFS.
DP900 Automated Repacking System
DP900 is a multi-functional packaging system that integrates tube, tray and tape package equipment which allows versatility and flexibility to meet different packing requirement. It is designed to be fully automatic and each package equipment is modularized as a sub-system for easy configuration and allows efficient work turnaround time. In addition, DP900 supports JEDEC standard tray, various SOP tubes and up to 22” tape reel, which is equipped with different sensors to ensure packaging quality and prevent human or system errors. Optional CCD camera can be added to the system for 2D inspection and ink marker for IC marking. LCD keypad is available for each sub-system to allow easier maintenance and troubleshooting.
Automated IC Programming System (Subsystem)
Auto Tray-250 Auto Tray Loader
Are you still changing the trays by yourself whenever the tray is fully loaded? Auto Tray-250 is an automatic loader specifically for tray input and output. It can accommodate up to 20 to 25 JEDEC standard trays at once and it can perfectly combine with DediProg's automated IC programming systems, DP1000-G2 and DP3000-G2, or other third party automation. Once the tray is filled up with IC, the trays will exchange automatically, and it will only take about 25 seconds!
Auto Tray-260 Adjustable Tray Loader (Lengthwise)
Auto Tray-260 is the first adjustable auto tray loader that can be integrated with DP automated handlers. Unlike Auto Tray-250, it is not only 2 in 1 function (tray in & tray out), but also can support more than 20 types of nonstandard trays. The dimension coverage is from 120 to 154mm width and 300 to 323mm length. Also, it is capable to load 25 trays at once to make your automated production line more efficient.
Auto Tray-350 Auto Tray Loader
Auto Tray-350 series is specifically for tray input and output, which supports 20 to 25 JEDEC standard trays. The machine can perfectly combine with DediProg's automated IC programming system and support online ink marking. Differ from the Auto Tray-250 is that Auto Tray-350 can work independently as tray marker, and is able to save eight setting files of tray condition for ink marking in the embedded memory.
DP600-A Automated Taping Machine
DP600-A is a new generation Automated taping machine, which is designed to be simple and easy operated; tape width adjustment can be finished within 10 seconds without any tool. DP600-A supports devices packaged in 8~88mm width tape. With advanced characteristics, DP600-A offers the best solution for the manufacturing process.
DP600-M2 Semi-Auto Taping Machine
DP600-M2 is a desktop semi-auto taping machine that is able to work independently; designed to be simple and easy to operate. It has both PSA (Press sensitive adhesive) and heat sealing functions. Support 8~88mm tape width; able to finish adjustment within 10 seconds without any adjustment tool. With advanced characteristics, DP600-M2 offers the best solution for the manufacturing process.
Electrical Tape Feeder
ETF (Electrical Tape Feeder) series is a tool for tape input, which is compatible with DediProg automated programming systems.
There are 8mm, 12mm, 16mm, 24mm, 32mm and 44mm for different IC package sizes. If the IC devices that you are going to program are in tapes, then this is the right choice for you!
AFS-120 Multiple Feeders Loading Preparation Station
DediProg has designed a multiple feeders loading preparation station, AFS-120, for tape input. It supports different sizes of electrical tape feeders from 8mm up to 44mm. The maximum slots are up to six units, and the power is fully connected for each slot. It is designed with 4 mobile wheels, which can be moved around and set up easily. Also, the bottom space is designed to store related parts, such as carrier tapes, etc. AFS-120 is not only cost effective but efficiency enhanced as well. Enjoy faster preparation and easy operation now!
LF-100P Label Printer
LF-100P supports online label printing. It can perfectly print barcode, QR code or simply series number, letters & characters. The image resolution is up to 600dpi, the printing speed is about 600mm/s, and it supports the label size from 4x4mm to 10x10mm. Integrated with DP automated handler- DP series, it will benefit your SMT production line to be more multi-functional and efficient.
ALM-610 IR Laser Marker
ALM-610 (Auto Infrared Laser Marker) & ALM-610-NS ( Auto Nano Size Laser Marker) are both designed for Dediprog online laser on programming handlers.
Both of them can be perfectly combined with DediProg automated programming system. It can laser before or after programming. The IC top marking area supports up to 30*30mm. ALM-610-NS is specially designed for the small devices such as WLCSP and BGA; the minimum IC size can be 1.5*0.85mm.
Backup Boot Flash Modules
Backup Boot Flash Module-DIP Socket
The Backup Boot Flash-DIP is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool DIP socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.
The BBF-DIP can be used as emulator by connecting it to the application DIP socket (remove the DIP serial flash on the application) with our BBF cable (included) and DIP cable adaptor. Or the BBF DIP can be used as a programmer for serial flash in DIP packages if used together with SF100.
The Serial Flash can be easily changed manually thanks to the DIP socket or even updated by connecting our SF100 programmer. The SF100 programmer is completely transparent for the application and will offer to developer high flexibility for code trials or update.
Please note that the BBF modules only support 3.3V/2.5V IC.
Backup Boot Flash Module-SO8N(150mil) socket
The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO8N socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.
Backup Boot Flash Module-SO8W(207mil) socket
The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO8W socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.
Backup Boot Flash Module-SO16W(300mil) Socket
The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO16W socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.
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Backup Boot Flash Module-Dual SO8W(207mil) Sockets
The Dual SO8W Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the two backup SPI Flash inserted in our tool SO8W sockets and no more on the two Main Serial Flash soldered on board. At the connection, the BBF tool will disable automatically the two Main Serial Flash that does not need to be unsoldered.
The BBF Dual SO8W tool allows working on two Backup Serial Flash providing that they are controlled by the same SPI bus and two different Chip select in the application board.
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Backup Boot Flash Module QUAD-8W Socket
The Backup Boot Flash QUAD (BBF-QUAD-8W) is an ingenious tool created by DediProg to allow the application controller to work on the backup SPI Flash inserted in our tool SO8W socket. It allows the application controller to access the backup SPI Flash with SPI single/Dual/Quad IO mode.
Backup Boot Flash Kit
BBF SO8W(207mil) Socket + SF100 Programmer
The Backup Boot Flash Kit (SO8W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 3 different methods:
- On the Main Serial flash package soldered on board by using our BBF Test Clip(SO8) (included).
- On our SMT 1.27mm Pin Header (included) soldered in place of the Main Serial flash footprint for a better stability by using the appropriate BBF cable (included).
- On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).
BBF SO16W(300mil) Socket + SF100 Programmer
The Backup Boot Flash Kit (SO16W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 2 different methods :
- On the Main Serial flash package soldered on board by using our SO16W Test Clip (included).
- On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).BF SO16W(300mil) Socket + SF100 Programmer.
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BBF Dual SO8W(207mil) Sockets + SF100 Programmer
The Backup Boot Flash Kit (Dual SO8W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash tool (included) can be connected to the application by 3 different methods:
- On the Two Main Serial flash packages soldered on board by using our Dedicated BBF Test Clip (included).
- On our Two SMT 1.27mm Pin Headers (included) soldered in place of the Two Main Serial flash footprints for a better stability by using the appropriate 2.54mm to 1.27mm cable adaptor-dual header (included)
- On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).
BBF SO8N(150mil) Socket + SF100 Programmer
The Backup Boot Flash Kit (SO8N) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 2 different methods :
- On the Main Serial flash package soldered on board by using our SO8 Test Clip (included).
- On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).
UFS IC Readers
UFSProg-CS UFS IC Reader Board
UFSProg Series is a professional reader tool to read and write data in each LUN of UFS IC. With a powerful bridge controller IC, DP7000, UFSProg series can support UFS v2.1 up to Gear 3 speed and USB3.1 Gen1 with UASP high-performance protocol.
SMT Sockets
SPI Flash Socket 8 Pin-1
This socket is designed for chips with SO8W 207 mil package. The socket can be soldered directly on the SO8W 207 mil PCB foot print.
SPI Flash Socket 16 Pin
The socket is designed for chips with SO16W 300 mil package. The socket can be soldered directly on the SO16W 300 mil PCB foot print.
SPI Flash Socket 8 Pin
This socket is designed for chips with SO8W 207 mil package. The socket can be soldered directly on the SO8W 207 mil PCB foot print.
Surface Mount TSOP56 Socket
Surface Mount TSOP56 socket is designed to be soldered directly on TSOP56 PCB foot print. With this socket, engineers no longer have to solder or desolder the TSOP56 chips during the development phase.
SPI Flash Socket WSON8 6*8
The socket is designed for chips with WSON8 6*8 mm package. The socket can be soldered directly on the WSON8 6*8 mm PCB foot print.
SPI Flash Socket 8 Pin-150mil
The socket is designed for chips with SO16W 300 mil package. The socket can be soldered directly on the SO16W 300 mil PCB foot print.
